ASAT Holdings Limited, incorporated on October 20, 1999, is a global provider of semiconductor assembly and test services that operates in the United States, Germany, Hong Kong, Japan, South Korea and Singapore. The Company's products and services can be grouped into four categories: chipscale packages (CSP), non-chipscale laminate packages, non-CSP leadframe packages and test services. ASAT Holdings offers Fine Pitch BGA (fpBGA), Leadless Plastic Chip Carrier (LPCC) and Thin Array Plastic Packaging (TAPP), chipscale packages. Non-CSP laminate packages include Plastic BGA (PBGA), Tape BGA (TBGA) and Flip Chip Packages. Non-CSP leadframe packages include Enhanced Dissipation QUAD (EDQUAD) and Multi-System in a Package (MSP) technology. ASAT Holdings provides an array of test services for digital logic, analog and mixed-signal products. During the year ended April 30, 2005 (fiscal 2005), ASAT Holdings shipped products to over 100 customers, including Altera, Analog Devices, Inc., Broadcom Corporation and SigmaTel, Inc. Chipscale Packages The Company's chipscale packages have advanced thermal and electrical characteristics. The chipscale packages are slightly larger than a semiconductor chip, which allow reduced package inductance and enhanced electrical performance. Chipscale packages are designed for high-pin count semiconductors that require dense ball arrays in very small-package sizes, such as wireless telephones, personal digital assistants (PDAs), video cameras, digital cameras and pagers. fpBGA is found in a range of device applications such as memory, application specific integrated circuits (ASICs), logic, analog, radio frequency (RF) devices and small programmable logic devices. The end user applications for this package type are primarily mobile phones and pagers, notebook computers, PDAs or other wireless/portable personal computing systems. fpBGA packages offer a packaging option for integrated circuit devices for a range of input/output (I/O) counts, while meeting the increasing requirements for small, light and thin package configurations. ASAT Holdings offers several fpBGA packages, such as the Thermal fpBGA, which is a strip mold compatible array with an imbedded heatsink suitable for products with high-operating temperatures. The LPCC is a patented version of the quad flat pack, no lead device known as the QFN plastic package. The LPCCs are designed for use in mobile communications, particularly cell phones, analog to digital and digital to analog circuits, and the power management circuits used in consumer electronics. These packages are based on a technology that relies on conventional leadframes as the base material. The leads in LPCC packages do not protrude from the package but are flat with the package surface. The TAPP is another of the Company's product technology packages, which provides metallic contacts to the circuit board that allows high-density circuitry in a small footprint package. Chipscale packages accounted for 54% of total sales in fiscal 2005. Non-CSP Laminate Packages Non-CSP laminate packages are characterized by a semiconductor chip mounted on an organic, often plastic resin, substrate. Non-CSP laminate package technology is used in applications, including hand held consumer products, enterprise networks, digital video disk players, home video game machines, wireless products, PDAs and video cameras, computing platforms and telecommunications switching stations and routers and consumer electronic products. PBGA is a non-CSP laminate package technology, which was developed to accommodate the increasingly high-lead counts required for advanced semiconductors and to provide an increased circuit density per unit area. ASAT Holdings' patented TBGA packages offer superior thermal management and electrical performance in a laminate substrate type configuration. The TBGA also allows for a higher routing density than its conventional PBGA packages. These packages are designed for use in complex semiconductor products, such as test systems, wireless communications s

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