STATS ChipPAC Ltd., incorporated on October 31, 1994, is a service provider of semiconductor-packaging design, assembly, test and distribution solutions. It provides semiconductor packaging and test solutions to a customer-base servicing the computing, communications, consumer, automotive and industrial markets. Its services include Packaging services, which provides leaded, power and array packages designed to provide customers with packaging solutions and full back-end turnkey services for a wide variety of electronics applications; Test services, which includes wafer probe and final testing, on a diverse selection of test platforms, covering the test platforms in the industry, and Pre-production and post-production services, which includes package development, test software and related hardware development, warehousing and drop-shipment services. In August 2004, the Company completed the merger with ChipPAC, Inc., which resulted in ChipPAC, Inc. becoming a wholly owned subsidiary of ST Assembly Test Services Ltd. Packaging services Packaging serves to protect the die and facilitate electrical connection and heat dissipation. As a part of customer support on packaging services, the Company also offers complete package design, electrical and thermal simulation, measurement and design of lead-frames and substrates. The two key types of packaging services, lead-frame and array contributed approximately 22% and 50.2%, respectively, of pro forma net revenues for the year ended December 31, 2005. Leaded or lead-frame package is the most widely used package type and is used in almost every electronic application, including automobiles, household appliances, desktop and notebook computers and telecommunications. With leaded packages, the die is attached to a lead-frame (a flat lattice of leads) and very fine gold wires are bonded (welded) to the chip and then welded to the leads to provide the interconnect. The chip is then encapsulated in plastic to form a package, with the ends of the lead-frame leads protruding from the edges of the package to enable connection to a printed circuit board (PCB). Specific packaging customization and improvements are continually being engineered to improve electrical and thermal performance, shrink-package sizes and enable multi-chip capability. The standard lead-frame packages are used in a variety of applications, including mobile phones, notebook computers and networking systems. The Company focuses on high-performance, thin-profile and near chip-scale, lead-frame packages. The enhanced lead-frame packages are similar in design to the Company's standard lead-frame packages but are generally thinner and smaller and have advanced thermal and electrical characteristics, which are necessary for many of the leading-edge semiconductors designed for communications applications. Power semiconductors are used in a variety of end-markets, including telecommunications and networking systems, computers and computer peripherals, consumer electronics, electronic office equipment, automotive systems and industrial products. Array substrate-based packaging is used primarily in computing platforms, networking, hand-held consumer products, wireless communications devices, personal digital assistants, video cameras, home electronic devices, such as digital versatile discs (DVDs) and home video game machines. Test Services The Company provides its customers with semiconductor test services for a number of device types, including mixed-signal, digital logic, memory, power and radio-frequency devices. Semiconductor testing measures and ensures the performance, functionality and reliability of a packaged device and requires knowledge of the specific applications and functions of the devices being tested. It offers wafer probe and final testing on many different platforms covering the test platforms in the industry. Wafer probe is the step immediately prior to the packaging of semiconductors, and involves electrical testing of the processed wafer for defects. Wafer probe services require simi

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