Surfect Holdings, Inc., together with its subsidiary, Surfect Technologies, Inc., develops automated electroplating tools for the solar energy and semiconductor power management device industries in the United States. It offers advanced metallization, interconnect, and module process and tool solutions for solar cell, LED, and power management applications. The companys products include hardware-plating technologies and subsequent tool platforms to support solar cell fabrication and solar module assembly in a Back End Of Line environment. Its technology platform comprises Direct Energy Plating, an electro-sonic deposition process that uses various forms of ultrasonic energy inputs to create solid-state agitation to deposit metals in a series. Surfect Holdings tools are designed to deposit conductive metals on solar cells and wafers through a proprietary electroplating process, which involves the coating of an electrically conductive object with a layer of metal using electrical current. It serves solar manufacturers, solar technology development groups, fables solar process providers, and solar module suppliers. The company was founded in 2000 and is headquartered in Tempe, Arizona.