Siliconware Precision Industries Co., Ltd. provides semiconductor packaging and testing services in the United States, China, Taiwan, Europe, and internationally. It provides packaging and testing solutions, including advanced packages, substrate packages, and lead-frame packages, as well as testing for logic and mixed signal devices to measure and ensure the performance, functionality, and reliability of packaged semiconductor devices. The company also offers turnkey services, including packaging, testing and shipment; and flip-chip and wafer bumping services. Its substrate packages category employs the ball grid array design, which utilizes a laminated substrate and places the electrical connections on the bottom of the package; and lead-frame packages that are characterized by a semiconductor chip encapsulated in a plastic molding compound with metal leads on the perimeter. The company's testing services include wafer probing that involves sorting the processed wafer for defects; final testing services for logic and mixed signal and RF integrated circuit packages; burn in services for testing products; and other testing services, such as system-level testing, lead/ball scanner, marking, and tape and reel services. It serves customers in the personal computer, communications, consumer integrated circuits, and non-commodity memory semiconductor markets. The company has a strategic alliance with Tsinghua Unigroup Ltd. Siliconware Precision Industries Co., Ltd. was founded in 1984 and is headquartered in Taichung, Taiwan.

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